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LHR21ES Rupes Bigfoot

LHR21ES Rupes Bigfoot

This product is not available in leasing.



Delivery costs:
In our officefor free
Riga8.10 EUR
Riga district8.10 EUR
Regional centers9.96 EUR
Rest of the Latvia9.96 EUR
3.56 EUR

320.00


Price to 2024-04-20
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Features

TIME SAVING UP TO 40%
The new Big Foot polisher is an amazing tool that enables you to obtain excellent results in no time. LESS steps, LESS time, LESS compound
consumption and GREATER profits.
40% ENERGY SAVING
Thanks to their design and technology, the new random orbital polishers by RUPES are more energy efficient as compared to traditional polishers.
NO HOLOGRAMS
Holograms are micro scratches made by traditional polishers: the new random orbital polishers don&#39;t leave holograms and enable excellent results in a single step.
EASY TO USE
Polishing has always been considered an operation that requires experience and skill. Inexperience may in fact result in surfaces being damaged and in the exposure of edges and sharp corners. RUPES has eliminated these risks with its new random orbital polisher that enables even less experienced operators to achieve professional results.
SUPERIOR FINISH
The goal of operators has always been achieving two results: gloss and colour depth. In designing its polishers, RUPES has taken these requirements into account to allow operators to achieve unique and extraordinary results.
MAXIMUM CONTROL
RUPES polishers stand out because of their accuracy and easiness of use, which enable to obtain high quality results with less fatigue.
NO SURFACE OVERHEATING
Superficial temperature must be kept within specific safety limits. The random orbital movement and technical features of new RUPES polishers maintain the superficial temperature within acceptable limits end eliminate the risk of &ldquo;burning&rdquo; the clearcoat.
LARGER CONTACT AREA
The new RUPES random orbital polishers enable to use the whole surface of the buffer. When using traditional rotary polishers , it is necessary to maintain the buffer inclined as compared to the work surface due to the high temperatures that develop on the machined panel, which reduces the useful surface of the buffer to 40 %.

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